The
defects of LED wafer may be caused from the manufacturing environments such as
contamination. The appearance of the defects can results in functional faults
of LED wafer. Therefore, it is very necessary to detect the defects in LED
wafer. In this paper, a new method is presented for the defect feature
acquisition of LED wafer, the method uses region growing to segment the LED
wafer image in order to acquire the defect features. The clustering strategy is
added to the region growing for enhancing the acquisition precision of defect
features. The defect features that have been obtained can be used to detect
these defects of LED wafer. The method consists of following two steps. First
of all, the original image of LED wafer is partitioned into several sub-blocks
that are not overlapped, and then these sub-blocks are segmented by clustering
strategy. Secondly, the whole wafer image is segmented by using region growing
algorithm.
Source:Zhong Liang Pan
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Defect Feature Acquisition of LED Wafer Using Region Growing Segmentation with
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